3M™ Electrically Conductive Thermosetting Film 2201P typically has the highest electrical conductivity, adhesion, and overall performance of conductive pressure sensitive adhesive (CPSA) products due to the thermoset resin. The excellent conductivity makes it ideal for small contact areas. This tape requires a modest thermal bonding process under pressure and special storage conditions. This tape provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.
Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment
Passive intermodulation (PIM) management
From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.
Typical properties
Details
|
Adhesion Strength (Imperial) |
1420 gf/in |
|
Adhesive Type |
Epoxy/Acrylic Hybrid Resin |
|
Application |
Grounding |
|
Backing (Carrier) Material |
Non-woven |
|
Brands |
3M™ |
|
Electrical Resistance |
Z-axis 0.2 Ω |
|
Liner Material |
PET |
|
Maximum Operating Temperature (Celsius) |
95 ℃ |
|
Maximum Operating Temperature (Fahrenheit) |
203 ℉ |
|
Minimum Operating Temperature (Celsius) |
-40 ℃ |
|
Minimum Operating Temperature (Fahrenheit) |
-40 ℉ |
|
Product Color |
Gray |
|
Product Usage |
Sensors, Flexible Printed Circuits, Printed Circuit Boards |
|
Shelf Life |
12 Month |
|
Total Tape Thickness without Liner (Imperial) |
2.5 mil |
|
Total Tape Thickness without Liner (Metric) |
0.065 mm |
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