Applications:-
Used for magnetic shielding in printed and flexible circuits
Ideal for sensors and semiconductor chip protection
Applied on cables to manage electromagnetic flux direction
Performance Features
• 5um PSA layer
• High initial adhesion
• Good wettability
• Non residue after high
temperature process
• Linered
Performance Features
• Anti-Erosion in Electrolyte,
• Chemical Resistant,
• Flame Retardant (UL510FR),
• Good Insulation,
• Halogen Free,
• No Adhesive Residue
Performance Features
• Chemical Resistant,
• No Adhesive Residue
• Linered
Applications:-
Designed for PCB solder masking in high-temp environments
Protects sensitive components from electrostatic discharge
Suitable for flame-retardant insulation in electronics assembly
Ideal for surface protection during wave soldering or reflow processes
Applications:-
Highlights:-
Features and Benefits
• Abrasion, chemical and thermal resistant
• Removes cleanly from stainless steel after 30 min at 218°C (425°F)
• Higher heat resistance as compared with acrylics
• Easy and clean removability
• Polyethylene tape core instead of cardboard
Key Features:
Non-silicone acrylic adhesive avoids silicone contamination
High-temperature resistance for solder masking and insulation
Polyimide film offers mechanical durability and chemical resistance
Black color for anti-reflective and scratch-protection applications
3.2 mil total thickness for balanced strength and flexibilit
Key Features
• No adhesive residue after removal
• Low static upon liner release and when taping circuit board
• Moisture barrier packaging plus desiccant
• Humidity extremes do not affect tape properties
• Easy manual and machine application
• Die-cuttable